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High Tg Lead Free Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS with 0.5oz-3oz Copper 0.5-3.2mm Thick

Shenzhen Bicheng Electronics Technology Co., Ltd

High Tg Lead Free Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS with 0.5oz-3oz Copper 0.5-3.2mm Thick

Brand Name : Bicheng Technologies Limited

Model Number : BIC-506-V0.81

Certification : UL

Place of Origin : China

MOQ : 1

Price : USD 2.99-9.99 PER PIECE

Payment Terms : T/T, Western Union

Supply Ability : 45000 pieces per month

Delivery Time : 10 working days

Packaging Details : Vacuum

Number of Layers : 2

Glass Epoxy : IT-180ATC

Final foil : 1.5

Final height of PCB : 1.6 mm ±10%

Surface Finish : HASL Lead free

Solder Mask Color : Blue

Colour of Component Legend : White

Test : 100% Electrical Test prior shipment

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High Tg Lead Free Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS with 0.5oz-3oz Copper 0.5-3.2mm Thick

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

IT-180ATC is an advanced high Tg (175℃ by DSC) multifunctional filled epoxy with high thermal reliability and CAF resistance. It’s suitable for various application and can pass 260℃ lead free assembly.

Applications

Automotive (Engine room ECU)

Multilayer and HDI PCB

Backplanes

Data Storage

Server and Networking

Telecommunications

Heavy Copper

High Tg Lead Free Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS with 0.5oz-3oz Copper 0.5-3.2mm Thick

Key Features

Low CTE

High heat resistance

Excellent CAF resistance

Good through-hole reliability

Our PCB Capability (IT-180ATC)

PCB Material: High Tg, Lead Free High Reliability Epoxy Resin
Designation: IT-180ATC
Dielectric constant: 4.4 at 1GHz
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB thickness: 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

Appendix: General Properties of IT-180ATC

Items IPC TM-650 Typical Value Unit
Peel Strength, minimum 2.4.8 lb/inch
A. Low profile copper foil 5
B. Standard profile copper foil 8
Volume Resistivity 2.5.17.1 1x109 M-cm
Surface Resistivity 2.5.17.1 1x108 M
Moisture Absorption, maximum 2.6.2.1 0.1 %
Permittivity (Dk, 50% resin content) --
A. 1MHz 2.5.5.9 4.5
B. 1GHz 2.5.5.9 4.4
Loss Tangent (Df, 50% resin content) --
A. 1MHz 2.5.5.9 0.014
B. 1GHz 2.5.5.9 0.015
Flexural Strength, minimum N/mm2
A. Length direction 2.4.4 500-530
B. Cross direction 410-440
Thermal Stress 10 s at 288°C
A. Unetched 2.4.13.1 Pass Rating
B. Etched Pass
Flammability UL94 V-0 Rating
Comparative Tracking Index (CTI) IEC 60112 / UL 746 CTI 3 (175-249) Class (Volts)
Glass Transition Temperature(DSC) 2.4.25 175 ˚C
Decomposition Temperature 2.4.24.6 345 ˚C
X/Y Axis CTE (40℃ to 125℃) 2.4.41 11-13 / 13-15 ppm/˚C
Z-Axis CTE
A. Alpha 1 45 ppm/˚C
B. Alpha 2 2.4.24 210 ppm/˚C
C. 50 to 260 Degrees C 2.7 %
Thermal Resistance
A. T260 2.4.24.1 >60 Minutes
High Tg Lead Free Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS with 0.5oz-3oz Copper 0.5-3.2mm Thick


Quality High Tg Lead Free Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS with 0.5oz-3oz Copper 0.5-3.2mm Thick for sale

High Tg Lead Free Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS with 0.5oz-3oz Copper 0.5-3.2mm Thick Images

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